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吳永富 期刊論文

最後更新日期 : 2013-05-20
  1. T. H. Tsai and Y. F. Wu (2006) “Organic Acid Mixing to Improve ITO Film Etching in Flat Panel Display Manufacture,” J. Electrochem. Soc., 153 (1) C86-C90.
  2. T. H. Tsai and Y. F. Wu (2006) “Wet Etching Mechanisms of ITO Films in Oxalic acid,” Microelectronic Engineering, v83, 536-541.
  3. T. H. Tsai and Y. F. Wu (2006) “Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing,” Chemical Engineering Communications, 193, 702-714.
  4. T. H. Tsai, Y. F. Wu and S. C. Yen (2005) “Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing,” Microelectronic Engineering, v77, 193-203.
  5. T. H. Tsai, Y. F. Wu and S. C. Yen (2003) “A Study of Copper Chemical Mechanical Polishing in Urea-Hydrogen Peroxide Slurry by Electrochemical Impedance Spectroscopy,” Applied Surface Science, 214, 1-4, 120-135.
  6. Y. F. Wu, W. L. Chou and S. C. Yen (2000) “Removal of mercury and methylmercury from contaminated soils by applying an electric field,” Journal of Environmental Science and Health, Part A: Toxic/Hazardous Substances and Environmental Engineering, v35, 7, 1153-1170.
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